Stabilizing Cu0-Cuδ+ sites via ohmic contact interface engineering for ampere-level nitrate electroreduction to ammonia
Stabilizing Cu0-Cuδ+ sites via ohmic contact interface engineering for ampere-level nitrate electroreduction to ammonia
研究概述
研究内容请参见论文原文。
谱图与表征信息
Fig. 3 | Electrocatalytic NO3RR performance of Cu@In(OH)3 electrocatalyst. a LSV curves of Cu@In(OH)3 at a scan rate 50 mV s−1 in 0.1 M KOH with/without 0.1 M NO3 −. b NH3 FEs of Cu, In(OH)3, and Cu@In(OH)3. c NH3 yield rate of Cu, In(OH)3, and Cu@In(OH)3. d in situ XANES spectra of Cu@In(OH)3. e LCF results of the corresponding XANES spectra. f FT Cu K-edge EXAFS spectra of Cu@In(OH)3 at different time. g The cyclic stability test of Cu@In(OH)3. Experimental conditions: electrocatalytic NO3RR was conducted in an H-cell separated by a Nafion 117